As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...
Ensuring the reliability of multi-die assemblies requires a variety of approaches to detect subsurface defects. Bonds and interconnects are especially problematic and require more inspection ...
The IPC Apex Expo 2017 got underway Feb. 14 in San Diego with a keynote address by the actor Mayim Bialik, who also earned a Ph.D. in neuroscience from UCLA. Bialik plays a neurobiologist on the TV ...
As part of his major new study on solder-joint quality, Stig Oresjo, formerly with Agilent Technologies and now principal of Test Strategy Consulting, compiled data on the effectiveness of each ...
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