The XBox PCB always had footprints for extra RAM chips, so RAM upgrades were simple – just get some new RAM ICs and solder them onto the board. However, in the hardware revision 1.6, these ...

In a large bowl, stir together the flour, chocolate chips, sugar, baking powder, baking soda, and salt. In a separate bowl, ...

HRL Laboratories plans to surpass heat transfer metrics set out by the Defense Advanced Research Project Agency (DARPA) with a novel cooling system for stacks of microelectronic chips. The program ...

"The challenge in cooling this 3DHI stack of chips is local heat density," Roper continued. "We need to cool the heat equivalent of more than 190 laptop CPUs, but in the size of a single CPU package." ...