You just built a breadboard of your expert design. You did all the simulations needed before going to layout, and reviewed the manufacturer's suggested techniques for a good thermal design for the ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...

In the analog/mixed-signal (AMS) arena, automated design of advanced ICs has long remained an objective rather than a reality. For the AMS design expert, automated tools have too often seemed to ...

1. Metal layers are made thicker in this SRAM cell to compensate for the higher resistance caused by narrower wires. 2. As process feature size decreases, metal thickness and vertical spacing doesn’t ...

Driven by Moore’s Law and modern, ubiquitous computation power demand, the market will continue to demand higher chip performance. Therefore, modern chips with ever-higher power densities present ...

Analog IC design is a very challenging task as essential information is missing in the early design stages. Because the simulation of larger designs is exceedingly computationally expensive at lower ...