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  1. What kind of company is DISCO? | DISCO Corporation

    DISCO’s current main customers are semiconductor and electrical components manufacturers, who manufacture products at their own factories using DISCO equipment and processing tools …

  2. 株式会社ディスコ - DISCO

    DISCO Technical Review Kiru(切る)・Kezuru(削る)・Migaku(磨く)技術に関する技術見解・ 論文のページです。

  3. 2025 | News | DISCO Corporation

    Jun 2, 2025 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools …

  4. DGP8761 | Polishers | Product Information | DISCO Corporation

    The DGP8761 is compatible with grinding wheels, polishing wheels, dresser boards and other parts designed for existing DISCO 8000 Series equipment. In addition, the operation method …

  5. Investors | DISCO Corporation

    IR News News Disaster Information Stock DISCO Dividend Payout for Fiscal Year 2025 2025/10/29 Results Business Forecast Notification 2025/10/29

  6. KABRA|DISCO Corporation

    This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the …

  7. 2025年 | ニュース | 株式会社ディスコ - www-hq.disco.co.jp

    Jun 2, 2025 · 詳細については、ウェブサイト www.disco.co.jp をご覧ください。

  8. At DISCO, we select processing parameters, such as laser power and focal point, which are optimal for customer products through test cuts while aiming at establishing a more reliable SD …

  9. As it is expected that the demand for DISCO’s precision processing tools, which are used in the manufacturing of semiconductors and electronic components, will also continue to increase, …

  10. DISCO HI-TEC AMERICA, INC. USA Head Office/Sales & Service …

    Your Nearest DISCO Office DISCO HI-TEC AMERICA, INC. USA Head Office Sales & Service Office